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無鹵PI覆銅箔基材Halogen-Free Polyimide Film Based FCCL
產（chǎn）品特點：優異的耐高溫（wēn）高（gāo）濕性能良好的尺寸安定性
產品特點：
優異的（de）耐高溫（wēn）高濕性能
良好的尺寸安定性、撓曲性及耐離子遷移
優良的電性能，化（huà）學性能及（jí）耐熱性（xìng）能
不含（hán）鹵素, 阻燃（rán）性能達到UL94 VTM-0
本產（chǎn）品（pǐn）符合IPC規範
Feature：
Excellent high humidity and temperature resistance
Excellent dimensional stability，High flexibility and
Excellent Migration ability
Excellent electrical ,chemical and thermal property
Halogen free and Flame retardancy UL 94VTM-0
Meet with IPC standards
產品特性(FCCL Characteristic)：
| 特（tè）性 property | 單位 Unit | 條件 Condition | 標準（zhǔn） Standard | AFED131218 | AFED131212 | 測試方法 Test method | |
| Copper Foil | |||||||
| Adhesive | |||||||
| PI Film | |||||||
| Adhesive | |||||||
| Copper Foil | |||||||
| Peel Strength |
Kgf/cm (90˚) | normal |
H mil≧0.8 1 mil≧1.0 | 1.3~1.5 | 1.1~1.3 | IPC-TM-650 2.4.9 | |
| Dimension Stability | TD | % | Method B | ≦±0.15 | 0.05~0.10 | 0.40~0.08 | IPC-TM-650 2.2.4 |
| MD | % | -0.05~0.06 | -0.07~0.03 | ||||
| Solder Float Resistance | --- | 300℃/10sec | No Change Appearance | Pass | Pass | IPC-TM-650 2.4.13 | |
| Chemical Resistance | % | NaOH | ≦20 | 1~7 | 1~7 | IPC-TM-650 2.3.2 | |
| % | HCI | 1~8 | 1~8 | ||||
| % | IPA | 1~7 | 1~7 | ||||
| Moisture Absorption | % | D-24/23 | ≦2.0 | 0.9~1.3 | 1.0~1.4 | IPC-TM-650 2.6.2 | |
| Volume Resistance | Ω-cm | C-96/23/65 | ≧1012 | ≧1014 | ≧1014 | IPC-TM-650 2.5.17 | |
| Surface Resistance | Ω | C-96/23/65 | ≧1010 | ≧1012 | ≧1012 | ||
| Insulation resistance | Ω | C-96/23/65 | ≧109 | ≧109 | ≧109 | IPC-TM-650 2.6.3.2 | |
| Dielectric constant 10MHZ | --- | C-48/40/90 | ≦4.0 | 3.4~3.6 | IPC-TM-650 2.5.5.3 | ||
| Dissipation factor 10MHZ | --- | C-48/40/90 | ≦0.04 | 0.032~0.036 | |||
Note:1. Data shown above are nominal values for reference only，Details see Certification of Quality
2. Storage Condition：Vacuum Packaging: Below 30℃ for 1year，
Normal Packaging : Below 30℃,below 70% RH for 1year